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The Leica EM UC7 prepares excellent quality semi- and ultra-thin sections, as well as the perfectly smooth surfaces required for LM, TEM, SEM, and AFM examination. The precision mechanics, ergonomic design, and intuitive layout of the touchscreen control unit make the Leica EM UC7 ideal for the highest quality specimen preparation
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The balanced break method of the Leica EM KMR3 ensures perfect glass knives in three thicknesses 6,4 mm, 8 mm, and 10 mm.
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Leica EM CPD300 Automated Critical Point Dryer Fully computer controlled with an integrated touch screen user interface (7 inch)
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The Leica EM AC20 automatic contrasting system for ultrathin sections ensures minimum user contact with reagents and reduced reagent consumption.
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The Leica EM TP is an instrument used for fixation and dehydration of samples for further treatment. It can be used for resin processing for electron microscopy (EM) and light microscopy (LM).
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Unique ion beam milling device with two modified saddle field ion sources of variable ion energy for optimum results. It combines the preparation of TEM, SEM, and LM samples in a single benchtop unit.
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The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and AFM investigations.
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The Leica EM TRIM2 is a high-speed milling system with integrated stereomicroscope and LED ring illuminator for trimming of biological and industrial samples prior to ultramicrotomy.
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The Leica EM RAPID milling system for pharmaceutical research enables sample preparation for analysis of active ingredient distribution on solid-dose pharmaceuticals.
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The Leica EM TXP is a target preparation device for milling, sawing, grinding, and polishing samples prior to examination by SEM, TEM, and LM techniques.
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The Leica EM ACE900 is a high-end sample preparation system for freeze fracturing, freeze etching and high resolution cryo coating. This instrument is easy and intuitive to use.
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The EM ACE600 is a versatile high vacuum film deposition system, designed to produce very thin, fine-grained, and conductive metal and carbon coatings for the highest resolution analysis