Leica EM TIC 3X | Ion Beam Milling System

The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and AFM investigations. With the EM TIC 3X you achieve high quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in a near native state as possible. the Leica EM TIC 3X can be configured for applications of standard preparation, high throughput processing, and the preparation of extremely heat sensitive samples such as polymers, rubbers, or even biological material at low temperatures. Samples can be transferred to the (cryo) SEM under cryo-vacuum condition

Leica EM RES102 | Ion Beam Milling System

Unique ion beam milling device with two modified saddle field ion sources of variable ion energy for optimum results. It combines the preparation of TEM, SEM, and LM samples in a single benchtop unit. A variety of sample holders allows a diverse range of applications to be carried out. In addition to high-energy ion beam milling, the Leica EM RES102 can also be used for very gentle sample processing using low ion energy.

Ion Bean Milling

Leica EM TIC 3X | Ion Beam Milling System

The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and AFM investigations.

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Leica EM RES102 | Ion Beam Milling System

Unique ion beam milling device with two modified saddle field ion sources of variable ion energy for optimum results. It combines the preparation of TEM, SEM, and LM samples in a single benchtop unit.

Add To Quote Details