The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and AFM investigations.
Leica EM TIC 3X | Ion Beam Milling System
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Description
The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and AFM investigations.
With the EM TIC 3X you achieve high quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in a near native state as possible. the Leica EM TIC 3X can be configured for applications of standard preparation, high throughput processing, and the preparation of extremely heat sensitive samples such as polymers, rubbers, or even biological material at low temperatures. Samples can be transferred to the (cryo) SEM under cryo-vacuum condition
