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X-tra Slides have a positive charged surface which helps to bond tissue sections and cytology preparations. X‐tra slides are used for demanding H&E procedures that require tissue adhesion. Size: 1” x 3” x .04” (unless otherwise noted) -
X-tra Clipped Corner Slides are clipped at 45° angles to help reduce glass breakage and fragmentation when loaded into slide printers. -
The VCE has two vertical stripes dissecting the slide into three sections allowing vaginal, cervical and endocervical sampling on the same slide. The fully frosted side is completely frosted on one side and is used for body fluid specimens. -
Snowcoat Pearl slides are cost efficient slides, available in five colors for color-coded identification within the laboratory. -
Snowcoat Microscope Slides contain a colored marking area on the surface of the slide to facilitate easy marking/printing and color-coded identification. -
Snowcoat Clipped Corner Slides are clipped at 45° angles to help reduce glass breakage and fragmentation when loaded into slide printers. -
High‐quality sheet glass, manufactured under strict specifications and quality control procedures. Plain and frosted ground versions available. -
These slides are 3”x 1” White Snowcoat slides with two circles, each having a diameter of 1/2”. These circles match up with the Cytology Funnel, which is to be used for preparation of non-gyn cytology specimens. -
Beveled Edge Slides feature beveled edges and corners that make for easier handling. The 25 mm x 75mm slides are washed and carefully inspected to ensure quality. -
Apex Patient Control Box Slides have clearly designated areas for positive control and patient tissues. -
The Apex clipped corners are clipped at 45° angles to help reduce glass breakage and fragmentation when loaded into slide printers. -
The Apex BOND is an extension of the Apex Adhesive Slides portfolio that is specifically designed and validated for IHC staining on the BOND platform. The eight dots represent the usable areas of the Apex BOND for the different dispense volumes in the BOND processing modules.